If the majority of the PCB ground plain is closely sandwiched between metalised objects (battery and solar panel) is a ceramic chip antenna still a viable solution for LTE, or would an external dipole be preferable?
The Ceramic chip antenna could sit proud of the sandwich... but how much clearance would it require?
size of metalised objects : 80 by 125 (battery), 90 by 160 (solar), current pcb size approx 90 by160.
We are ideally looking for the best efficiency possible, and would like to avoid visable external antennas if possible.
The Ceramic chip antenna could sit proud of the sandwich... but how much clearance would it require?
size of metalised objects : 80 by 125 (battery), 90 by 160 (solar), current pcb size approx 90 by160.
We are ideally looking for the best efficiency possible, and would like to avoid visable external antennas if possible.