QUESTION

Question

Thank you for answering my previous question.    We have the board which functionally works on our rigid flex where the antenna is loaded in the flex area.   The problem we are having is with the consistency of getting good solder joints.    I am looking to see what the MFG recommended spec for stencil aperture and thickness is comparable to the footprint?   Is it 1:1 with a 5mil stencil?

Answer 1

Hello Viotale,

Please refer to the IPC-7525A standard, section 3.2 for the recommendation of solder stencil.  We recommend that you should follow this standard. 

Best regards,

Geoff S.